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English -- Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies - Edition 3.0
IEC 61191-1 (REDLINE + STANDARD)
Organization:
IEC - International Electrotechnical Commission
Year: 2018
Abstract: Scope: This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.
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English -- Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies - Edition 3.0
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| contributor author | IEC - International Electrotechnical Commission | |
| date accessioned | 2020-09-15T22:28:59Z | |
| date available | 2020-09-15T22:28:59Z | |
| date copyright | 2018.09.01 | |
| date issued | 2018 | |
| identifier other | ELGHGGAAAAAAAAAA.pdf | |
| identifier other | ELGHGGAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/289155 | |
| description abstract | Scope: This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. | |
| language | English | |
| title | English -- Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies - Edition 3.0 | en |
| title | IEC 61191-1 (REDLINE + STANDARD) | num |
| type | standard | |
| page | 146 | |
| status | Active | |
| tree | IEC - International Electrotechnical Commission:;2018 | |
| contenttype | fulltext |