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IPC TM-650 2.4.20
Terminal Bond Strength, Flexible Printed Wiring
Organization:
IPC - Association Connecting Electronics Industries
Year: 1973
Abstract: This test method is to determine the terminal bond strength, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane.
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IPC TM-650 2.4.20
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:35:22Z | |
| date available | 2017-09-04T15:35:22Z | |
| date copyright | 04/01/1973 | |
| date issued | 1973 | |
| identifier other | OPIKCAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/37234 | |
| description abstract | This test method is to determine the terminal bond strength, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane. | |
| language | English | |
| title | IPC TM-650 2.4.20 | num |
| title | Terminal Bond Strength, Flexible Printed Wiring | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1973 | |
| contenttype | fulltext |