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EIA RS-186-10E

STANDARD TEST METHODS FOR PASSIVE ELECTRONIC COMPONENT PARTS METHOD 10: EFFECT OF SOLDERING

Organization:
EIA - Electronic Industries Alliance
Year: 1978

Abstract: PURPOSE
This test is performed to determine the effect of normal soldering operations on component parts. Excessive changes in electrical characteristics or mechanical damage to a component part are often caused by the short-time application of high heat, such as is applied to integral component terminastions by a soldering iron or a solder-bath dip in assembly operations. The effect of soldering test is intended to simulate these manufacturing conditions and detect faults in component parts which otherwise may not be noticed until after final equipment assembly.
NOTE 1: (For a test for determining the ability of component part terminations to accept solder, see EIA Standard RS-178-A, Solderability Test Standard.)
NOTE 2: (A recommended solder is one in accordance with ASTM B32, Grade A, having a nominal composition of 60% tin and 40% lead.)
URI: https://yse.yabesh.ir/std/handle/yse/75744
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    EIA RS-186-10E

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contributor authorEIA - Electronic Industries Alliance
date accessioned2017-09-04T16:12:29Z
date available2017-09-04T16:12:29Z
date copyright28764
date issued1978
identifier otherSPAVDFAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/75744
description abstractPURPOSE
This test is performed to determine the effect of normal soldering operations on component parts. Excessive changes in electrical characteristics or mechanical damage to a component part are often caused by the short-time application of high heat, such as is applied to integral component terminastions by a soldering iron or a solder-bath dip in assembly operations. The effect of soldering test is intended to simulate these manufacturing conditions and detect faults in component parts which otherwise may not be noticed until after final equipment assembly.
NOTE 1: (For a test for determining the ability of component part terminations to accept solder, see EIA Standard RS-178-A, Solderability Test Standard.)
NOTE 2: (A recommended solder is one in accordance with ASTM B32, Grade A, having a nominal composition of 60% tin and 40% lead.)
languageEnglish
titleEIA RS-186-10Enum
titleSTANDARD TEST METHODS FOR PASSIVE ELECTRONIC COMPONENT PARTS METHOD 10: EFFECT OF SOLDERINGen
typestandard
page4
statusActive
treeEIA - Electronic Industries Alliance:;1978
contenttypefulltext
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