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IPC TM-650 2.5.8A
Dissipation Factor of Flexible Printed Wiring Material
Organization:
IPC - Association Connecting Electronics Industries
Year: 1975
Abstract: This test method provides a standard procedure to determine the dissipation factor of printed circuit materials.
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IPC TM-650 2.5.8A
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:24:32Z | |
| date available | 2017-09-04T16:24:32Z | |
| date copyright | 07/01/1975 | |
| date issued | 1975 | |
| identifier other | TVKGIBAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/87818 | |
| description abstract | This test method provides a standard procedure to determine the dissipation factor of printed circuit materials. | |
| language | English | |
| title | IPC TM-650 2.5.8A | num |
| title | Dissipation Factor of Flexible Printed Wiring Material | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1975 | |
| contenttype | fulltext |