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IPC TM-650 2.3.14
Print, Etch and Plate Test
Organization:
IPC - Association Connecting Electronics Industries
Year: 1973
Abstract: This test method provides a standard method for evaluating the effect of established processing operations used in the manufacture of PWBs on materials that are considered for use in the manufacture of PWBs. Specific criteria for the acceptability are based on copper foil adhesion and visual surface condition of the base laminate.
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IPC TM-650 2.3.14
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:27:52Z | |
| date available | 2017-09-04T16:27:52Z | |
| date copyright | 04/01/1973 | |
| date issued | 1973 | |
| identifier other | UEEUCAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/91021 | |
| description abstract | This test method provides a standard method for evaluating the effect of established processing operations used in the manufacture of PWBs on materials that are considered for use in the manufacture of PWBs. Specific criteria for the acceptability are based on copper foil adhesion and visual surface condition of the base laminate. | |
| language | English | |
| title | IPC TM-650 2.3.14 | num |
| title | Print, Etch and Plate Test | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1973 | |
| contenttype | fulltext |