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EIA RS-186-11E

STANDARD TEST METHODS FOR PASSIVE ELECTRONIC COMPONENT PARTS METHOD 11: THERMAL SHOCK IN AIR

Organization:
EIA - Electronic Industries Alliance
Year: 1978

Abstract: PURPOSE
This test is conducted for the purpose of determining the resistance of a component part to exposures at ! extremes of high and low temperatures in air, and to the shock of alternate exposures to these extremes. Permanent changes in operating characteristics and physical darnage produced during thermal shock result principally from variations in dimensions and other physical properties. Effects of thermal shock include cracking and delamination of finishes, cracking and crazing of embedding and encapsulating compounds, opening of terminal seals and case seams, leakage of filling materials, and change in efectricai characteristics- due to mechanical displacement or rupture of conductors or of insulating materials.
URI: http://yse.yabesh.ir/std/handle/yse/104695
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    EIA RS-186-11E

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contributor authorEIA - Electronic Industries Alliance
date accessioned2017-09-04T16:41:25Z
date available2017-09-04T16:41:25Z
date copyright28764
date issued1978
identifier otherVPAVDFAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std/handle/yse/104695
description abstractPURPOSE
This test is conducted for the purpose of determining the resistance of a component part to exposures at ! extremes of high and low temperatures in air, and to the shock of alternate exposures to these extremes. Permanent changes in operating characteristics and physical darnage produced during thermal shock result principally from variations in dimensions and other physical properties. Effects of thermal shock include cracking and delamination of finishes, cracking and crazing of embedding and encapsulating compounds, opening of terminal seals and case seams, leakage of filling materials, and change in efectricai characteristics- due to mechanical displacement or rupture of conductors or of insulating materials.
languageEnglish
titleEIA RS-186-11Enum
titleSTANDARD TEST METHODS FOR PASSIVE ELECTRONIC COMPONENT PARTS METHOD 11: THERMAL SHOCK IN AIRen
typestandard
page5
statusActive
treeEIA - Electronic Industries Alliance:;1978
contenttypefulltext
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