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ECIA - Electronic Components Industry Association: Recent submissions
Now showing items 341-360 of 507
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ECA EIA-540ABAA
Abstract: The Chip Carrier Sockets of assessed quality covered by this detail specification shall have:
a) Maximum enclosure dimensions that include cover and latching hardware as illustrated in Figure 1.
b) A working voltage ... -
ECA EIA-364-75A
Abstract: Introduction
Content
This standard establishes a test method to determine the capability of a connector pair to conduct the electrical current induced by a lightning strike. The results derived may ... -
ECA 540EA00
Abstract: Round Style Sockets
The Round Style Sockets of assessed quality covered by this Detail Specification shall have:
(a) Maximum enclosure dimensions (See figure 1).
(b) Working voltage not to exceed ________ volts ... -
ECA EIA-595-A
Abstract: This document covers the general industry inspection requirements for multilayer ceramic chip capacitors. The devices selected for inspection may be examined under 10 to 20 power magnification to determine compliance with ... -
ECA 520AAAE
Abstract: The illuminated and non-illuminated electronic control pushbutton switches of certified quality covered by this detail specification:
a) Mount in a panel hole of either 19.05 mm (.750 inch) square or ... -
ECA 216
Abstract: This Standard is intended for determining the following characteristics of printed wiring boards: (a) resistance to pull-off of lands before and after soldering of component leads, (b) resistance to peel or stripping of ... -
ECA EIA/ECA-310-E
Abstract: EIA-310-E is intended to provide overall design requirements for Cabinets, Panels, Racks and Subracks. When specifications are developed from EIA-310-E, agreements for that unit shall be made between the supplier and user. -
ECA 229-A
Abstract: This standard covers fixed precision wire-wound resistors of + 1{}ccuracy or better and various wattage ratings. Classes suitable for various applications are defined. -
ECA TEP116-C
Abstract: INTRODUCTION
This publication is comprised of two parts: general information on phosphors, and registered data on individual screens. It is intended to serve two groups of people: phosphor and CRT ... -
ECA IS-43AC
Abstract: This Detail Specification defines Type 1 Riser cable used with the Token Ring LAN Cabling System. Type 1 R consists of 2 twisted pairs of Data Grade Media (DGM) shielded with aluminum tape and braided shields, all cabled ... -
ECA TEP105-14
Abstract: This specification will outline test methods suitable for measuring persistence of CRT screens. This data will be used primarily for registration of phosphors in the WTDS system. This data may also be used as a general ... -
ECA 230
Abstract: General:
This standard provides color marking for thermoplastic insulated wire or color marking for thermoplastic jackets on wires and cables. In the case of transparent plastic jackets, the color ... -
ECA EIA/ECA-364-59A
Abstract: This standard establishes a test method for exposing electrical connectors and sockets to low temperature for a specified duration. -
ECA EIA-498AAAA
Abstract: The short stroke keypads of certified quality covered by this detail specification:
1) have maximum enclosure dimensions of 3.16 by 3.16 by .53 (excludes terminals and mounting studs)
2) have a maximum rated voltage ... -
ECA EIA-364-81A
Abstract: This standard establishes test method that may be used to characterize the resistance of connector/socket housings, including composite housings in their as molded condition with and without contacts relative to flammability ... -
ECA EIA-448-21
Abstract: PURPOSE
The purpose of this standard is to evaluate electromechanical surface-mountable components which have been subjected to the environmental effects of machine soldering using an infrared system.
This ... -
ECA EIA-448-20
Abstract: PURPOSE
The purpose of this test method is to determine whether the switch lens face meets the touch temperature (rise above ambient requirements) as defined in the Detail specification. -
ECA IS-46
Abstract: There are two basic processes for soldering surface mount connectors — vapor phase and infra-red. Both apply heat which the total connector systems is exposed to with no insulating medium (e.g. printed circuit boards) ...