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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 481-500 of 793
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IPC TM-650 2.5.15A
Abstract: It is the intent of these guidelines to describe the material properties and test procedures required to ensure effective RFI and EMI shielding of flat cable. -
IPC TM-650 2.6.5D
Abstract: This method is to determine the electrical performance of multilayer printed wiring boards by following the shock with an electrical continuity test as specified. -
IPC J-STD-005A
Abstract: This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality control document and is ... -
IPC IPC/WHMA-A-620B
Abstract: This standard prescribes practices and requirements for the manufacture of Cable, Wire and Harness Assemblies.
If a conflict occurs between the English and translated versions of this document, the English ... -
IPC 9691A
Abstract: This document is the product of the IPC Electrochemical Migration (ECM) Task Group. It was drafted to provide guidance regarding how the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance test can best ... -
IPC TM-650 2.4.28.1F
Abstract: This test method defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and after soldering), nonmelting ... -
IPC CC-830B CHINESE
Abstract: This standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the ... -
IPC TM-650 2.1.3A
Abstract: After selective chemical removal of the glassepoxy from around the through hole and its associated circuitry, an examination can be made with a microscope of the plated-through hole (PTH), pad, and conductor at any angle. -
IPC SM-785
Abstract: This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments ... -
IPC DR-572A
Abstract: This document is intended to provide guidelines for generating good quality holes in printed circuit boards (PCBs) made from a wide variety of materials. -
IPC 2224
Abstract: This standard establishes the requirements for the design of printed boards for PC card form factors. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials: the interconnections ... -
IPC TM-650 2.5.19.1A
Abstract: This test method describes the test procedures required to measure propagation delay in flat cables. This test method is an alternative to IPC-TM-650, Method 2.5.19. Propagation delay is defined as the time required for a ... -
IPC 9708
Abstract: This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods ... -
IPC TM-650 2.4.40
Abstract: This method is used to determine the inner layer bond strength of either a metal conductor or an individual dielectric. -
IPC TM-650 2.3.41
Abstract: The purpose of this test method is to measure the amount of chlorine and bromine compounds in base materials. This test method is applicable to reinforced base materials with a minimum thickness of 0.3 mm [0.012 in] and ... -
IPC T-50M
Abstract: This document is designed to provide definitions for terms commonly used in the electronics industry which have meanings specific to electronics. The definitions are intended to provide sufficient clarity of detail such ... -
IPC TM-650 1.8A
Abstract: Tests performed on presumably identical samples under seemingly identical conditions do not always yield identical results. This is due to errors inherent in every measurement or evaluation. During the development of a new ... -
IPC 7525B
Abstract: PURPOSE
This document provides a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive. It is intended as a guideline only. Much of the content is based on the ...