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JEDEC JESD51
Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
Organization:
JEDEC - Solid State Technology Association
Year: 1995
Abstract: This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of junction temperature for specific conditions. The data can be used for package design evaluation, device characterization and reliability predictions.
Subject: Single Semiconductor Device
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T16:46:06Z | |
| date available | 2017-09-04T16:46:06Z | |
| date copyright | 35034 | |
| date issued | 1995 | |
| identifier other | WBKSCAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/109388 | |
| description abstract | This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of junction temperature for specific conditions. The data can be used for package design evaluation, device characterization and reliability predictions. | |
| language | English | |
| title | JEDEC JESD51 | num |
| title | Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device) | en |
| type | standard | |
| page | 8 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;1995 | |
| contenttype | fulltext | |
| subject keywords | Single Semiconductor Device | |
| subject keywords | Thermal Measurement - Component Packages |