JEDEC JESD22-B115A

Abstract

This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force, fracture energy and failure mode data are collected and analyzed. Other specialized solder ball pull methods using a heated thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document. Both low and high speed testing are covered by this document. <br>Depending on test sample configuration, application and purpose of the test (characterization, qualification, production, etc.), other solder joint integrity assessment methods such as JEDEC Solder Ball Shear Test Method JESD22-B117, may be more appropriate. Generally, solder ball pull is most appropriate for devices that experience tensile loading during either the manufacturing/shipment process or end use, and have non-oblate (spherical, non-flattened) solder balls. <br>This test method is used to assess the ability of solder balls to withstand mechanical pull forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. To provide a tensile load, this solder joint integrity assessment technique employs mechanical jaws to clamp an individual solder ball of a free (unmounted) test sample. Solder ball pull is a destructive test.