درباره ما
JEDEC JESD51-31
Thermal Test Environment Modifications for MultiChip Packages
| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T18:16:11Z | |
| date available | 2017-09-04T18:16:11Z | |
| date copyright | 07/01/2008 | |
| date issued | 2008 | |
| identifier other | HMGWGCAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/199128 | |
| description abstract | This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, Guideline to Support Effective Use of MCP Thermal Measurements which is being prepared. | |
| language | English | |
| title | JEDEC JESD51-31 | num |
| title | Thermal Test Environment Modifications for MultiChip Packages | en |
| type | standard | |
| page | 18 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2008 | |
| contenttype | fulltext | |
| subject keywords | Chop | |
| subject keywords | Multi-Chip | |
| subject keywords | package | |
| subject keywords | Thermal | |
| subject keywords | Theta-JA |
