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JEDEC JESD51-31

Thermal Test Environment Modifications for MultiChip Packages

Organization:
JEDEC - Solid State Technology Association
Year: 2008

Abstract: This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, Guideline to Support Effective Use of MCP Thermal Measurements which is being prepared.
URI: https://yse.yabesh.ir/std/handle/yse/199128
Subject: Chop
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contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T18:16:11Z
date available2017-09-04T18:16:11Z
date copyright07/01/2008
date issued2008
identifier otherHMGWGCAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/199128
description abstractThis document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, Guideline to Support Effective Use of MCP Thermal Measurements which is being prepared.
languageEnglish
titleJEDEC JESD51-31num
titleThermal Test Environment Modifications for MultiChip Packagesen
typestandard
page18
statusActive
treeJEDEC - Solid State Technology Association:;2008
contenttypefulltext
subject keywordsChop
subject keywordsMulti-Chip
subject keywordspackage
subject keywordsThermal
subject keywordsTheta-JA
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