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JEDEC JEP142

Obtaining and Accepting Material for Use in Hybrid/MCM Products

Organization:
JEDEC - Solid State Technology Association
Year: 2009

Abstract: This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid / MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing / evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. 
URI: https://yse.yabesh.ir/std/handle/yse/214942
Subject: Assessment Techniques
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contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T18:32:47Z
date available2017-09-04T18:32:47Z
date copyright05/01/2002 (R 2009)
date issued2009
identifier otherJCDTPCAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/214942
description abstractThis document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid / MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing / evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. 
languageEnglish
titleJEDEC JEP142num
titleObtaining and Accepting Material for Use in Hybrid/MCM Productsen
typestandard
page32
statusActive
treeJEDEC - Solid State Technology Association:;2009
contenttypefulltext
subject keywordsAssessment Techniques
subject keywordsDesign Considerations
subject keywordsHybrid
subject keywordsMCM
subject keywordsMulti Chip Module
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