JEDEC JESD22-A113F

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T18:37:48Z
date available	2017-09-04T18:37:48Z
date copyright	39722
date issued	2008
identifier other	JOHMHCAAAAAAAAAA.pdf
identifier uri	https://yse.yabesh.ir/std/handle/yse/219648
description abstract	This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow).
language	English
title	JEDEC JESD22-A113F	num
title	Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing	en
type	standard
page	16
status	Active
tree	JEDEC - Solid State Technology Association:;2008
contenttype	fulltext
subject keywords	Preconditioning of Plastic Surface Mount Devices
subject keywords	Test Method - Plastic Surface Mount Preconditioning