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JEDEC JESD22-A113F

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

Organization:
JEDEC - Solid State Technology Association
Year: 2008

Abstract: This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow).
URI: https://yse.yabesh.ir/std/handle/yse/219648
Subject: Preconditioning of Plastic Surface Mount Devices
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    JEDEC JESD22-A113F

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contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T18:37:48Z
date available2017-09-04T18:37:48Z
date copyright39722
date issued2008
identifier otherJOHMHCAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/219648
description abstractThis Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow).
languageEnglish
titleJEDEC JESD22-A113Fnum
titlePreconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testingen
typestandard
page16
statusActive
treeJEDEC - Solid State Technology Association:;2008
contenttypefulltext
subject keywordsPreconditioning of Plastic Surface Mount Devices
subject keywordsTest Method - Plastic Surface Mount Preconditioning
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