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Guidelines for the Measurement of Thermal Resistance of GaAs FETs

contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T15:23:30Z
date available2017-09-04T15:23:30Z
date copyright07/01/1988
date issued1988
identifier otherNFKGCAAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/23760
description abstractThis publication is intended for power GaAs FET applications requiring high reliability. An accurate measurement of thermal resistance is extremely important to provide the user with knowledge of the FETs operating temperature so that more accurate life estimates can be made. FET failure mechanisms and failure rates have, in general, an exponential dependence on temperature (which is why temperature-accelerated testing is successful). Because of the exponential relationship of failure rate with temperature, the thermal resistance should be referenced to the hottest part of the FET.
languageEnglish
titleJEDEC JEP110num
titleGuidelines for the Measurement of Thermal Resistance of GaAs FETsen
typestandard
page11
statusActive
treeJEDEC - Solid State Technology Association:;1988
contenttypefulltext
subject keywordsGaAs FETs
subject keywordsMeasurement - Thermal Resistance of GaAs FETs
subject keywordsThermal Resistance - GaAs FETs


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