JEDEC JEP110
Guidelines for the Measurement of Thermal Resistance of GaAs FETs
contributor author | JEDEC - Solid State Technology Association | |
date accessioned | 2017-09-04T15:23:30Z | |
date available | 2017-09-04T15:23:30Z | |
date copyright | 07/01/1988 | |
date issued | 1988 | |
identifier other | NFKGCAAAAAAAAAAA.pdf | |
identifier uri | https://yse.yabesh.ir/std/handle/yse/23760 | |
description abstract | This publication is intended for power GaAs FET applications requiring high reliability. An accurate measurement of thermal resistance is extremely important to provide the user with knowledge of the FETs operating temperature so that more accurate life estimates can be made. FET failure mechanisms and failure rates have, in general, an exponential dependence on temperature (which is why temperature-accelerated testing is successful). Because of the exponential relationship of failure rate with temperature, the thermal resistance should be referenced to the hottest part of the FET. | |
language | English | |
title | JEDEC JEP110 | num |
title | Guidelines for the Measurement of Thermal Resistance of GaAs FETs | en |
type | standard | |
page | 11 | |
status | Active | |
tree | JEDEC - Solid State Technology Association:;1988 | |
contenttype | fulltext | |
subject keywords | GaAs FETs | |
subject keywords | Measurement - Thermal Resistance of GaAs FETs | |
subject keywords | Thermal Resistance - GaAs FETs |