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JEDEC J-STD-035
Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components
Organization:
JEDEC - Solid State Technology Association
Year: 2010
Abstract: This test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compound voids, etc.) nondestructively in plastic packages while achieving reproducibility.
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JEDEC J-STD-035
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T16:09:15Z | |
| date available | 2017-09-04T16:09:15Z | |
| date copyright | 05/01/1999 (R 2010) | |
| date issued | 2010 | |
| identifier other | BIPSMEAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/72468 | |
| description abstract | This test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compound voids, etc.) nondestructively in plastic packages while achieving reproducibility. | |
| language | English | |
| title | JEDEC J-STD-035 | num |
| title | Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components | en |
| type | standard | |
| page | 18 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2010 | |
| contenttype | fulltext |