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JEDEC - Solid State Technology Association: Recent submissions
Now showing items 81-100 of 369
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JEDEC JESD203
Abstract: This standard defines ac test loads for dual-supply level translation devices. Uniform test loads enable easy comparison of electrical parameters of dual-supply level translation devices across functions, logic families ...Subject(s) : Dual-Supply Volatage , Test Loads , Voltage Level Translation , Voltage Logic Levels , -
JEDEC JESD78D
Abstract: This standard covers the I-test and the overvoltage latch-up testing of integrated circuits.
The purpose of this specification is to establish a method for determining IC latch-up characteristics and to define latch-up ... -
JEDEC JESD82-15
Abstract: This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of a CUA878 PLL clock device for registered DDR2 DIMM applications. The purpose is to provide ...Subject(s) : CUA878 , DDR2 , PLL , RDIMM , -
JEDEC JEP79
Abstract: This publication is for photoconductive cells sensitive primarily in the visible and near infrared region.Subject(s) : Cells - Photoconductive , Photoconductive Cells , Test Method - Photoconductive Cells , -
JEDEC JESD76-1
Abstract: This standard defines dc interface, switching parameters and test loading for digital logic devices based on 1.2 V (nominal) power supply levels. The purpose is to provide a standard specification for uniformity, multiplicity ...Subject(s) : 1.2 V , CMOS , Wide Range , -
JEDEC JESD51-14
Abstract: This document specifies a test method (referred to herein as "Transient Dual Interface Measurement") to determine the conductive thermal resistance "Junction-to-Case" RθJC (θJC) ... -
JEDEC JESD94A
Abstract: The method described in this document applies to all application specific reliability testing for solid state components with known failure mechanisms where the test duration and conditions vary based on application ...Subject(s) : Application Specific , Knowledge Based , Qualification , Reliability Test Method , Test method - Application Specific , -
JEDEC JESD24-10
Abstract: Test method to measure the reverse recovery characteristics of the drain source diode of a power MOSFET.Subject(s) : Drain-Source Diodes , Measurement - Reverse Recovery Time (trr) , Power MOSFET Drain-Source Diodes , Reverse Recovery Time - Measurement of , Test Method - Power MOSFET Drain-Source Diodes , -
JEDEC JESD51-11
Abstract: This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Pin Grid Array (PGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover ...Subject(s) : PGA , Test Board , Thermal Test , Through-Hole Packages , -
JEDEC JESD51-8
Abstract: This specification should be used in conjunction with the overview document JESD51, Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device) [1] and the electrical test procedures described ...Subject(s) : Junction-to-Board , Test Method - Environmental Conditions , -
JEDEC JESD51-50
Abstract: The measurement methodology described herein is distributed among several documents so that the appropriate combination of documents can be selected to meet specific thermal measurement requirements. This document provides ... -
JEDEC JESD51-32
Abstract: This document addresses the need for extending the existing thermal test board standards to accommodate the potential of higher electrical connection needs of multi-chip packages (MCPs) and the associated wire routing to ... -
JEDEC JESD86A
Abstract: This standard is intended to describe various methods for obtaining electrical variate data on devices currently produced on the manufacturing and testing process to be qualified. The intent is to assess the deviceÂ's ...Subject(s) : Assessment - Electrical Parameter , Characterization , Electrical Charaterization , Parametric Shift , -
JEDEC JESD223B
Abstract: This standard describes a functional specification of the Host Controller Interface (HCI) for Universal Flash Storage (UFS). The objective of UFSHCI is to provide a uniform interface method of accessing the UFS hardware ... -
JEDEC JESD51-10
Abstract: This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Dual-Inline Packages (DIP) and Single-Inline Packages (SIP). It is intended to be used in conjunction with the JESD51 ...Subject(s) : DIP , Thermal Measurements , Through-Hole Packages , -
JEDEC JESD8‐25
Abstract: This document defines the 1.0 V Pseudo Open Drain Interface family of interface standards, POD10, which are generally expected to be implemented with differential amp-based input buffers that, when in singleended mode, ... -
JEDEC JESD210
Abstract: This standard is applicable to avalanche breakdown diodes when used as a surge protector or transient voltage suppressor (TVS). It describes terms and definitions and explains methods for verifying device ratings and ...Subject(s) : ABD , Avalanche , Breakdown , Diode , Suppressors , Transient , -
JEDEC J-STD-033C
Abstract: This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture sensitive devices made with ... -
JEDEC JEP131B
Abstract: This publication applies to electronic components and subassemblies product and or process development, manufacturing processes and the associated performance requirements in customer applications. These areas should ...