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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 461-480 of 793
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IPC CF-152B
Abstract: This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of invar (nominal 36% ... -
IPC TM-650 2.4.38A
Abstract: This procedure defines a test method used to determine the scaled flow parameters of an epoxy resin, pre-impregnated glass fabric (prepreg). The test is appropriate for checking material consistency, but is not solely ... -
IPC TM-650 2.4.1.6
Abstract: This test method establishes a procedure for determining whether the adhesion of a polymer coating to an inorganic or ceramic substrate is above an adequate level. The substrate may or may not have an oxide layer on the ... -
IPC 4412B
Abstract: This specification covers finished fabrics woven from ‘‘E'' glass electrical grade glass fiber yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. All ... -
IPC QF-143
Abstract: This specification covers finished fabrics woven from quartz fiber, yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use.
Purpose This specification determines ... -
IPC TR-468
Abstract: Introduction
Insulation resistance (IR) problems were identified by several printed-board fabricators in late 1974. These problems were reported to the laminate manufacturers to obtain assistance in ... -
IPC 9199
Abstract: This document is intended to be a tool for a customer or supplier organization’s internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This document should ... -
IPC 6012B SWEDISH
Abstract: Denna specifikation omfattar kvalificering av och utförande hos rigida mönsterkort. Mönsterkortet kan vara enkelsidigt, dubbelsidigt, med eller utan genompläterade hål. Det kan också vara ett ... -
IPC 9501
Abstract: This document describes manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after exposure to assembly factory ... -
IPC CH-65B
Abstract: This manual will only include assembly process printed wiring assembly cleaning. The corresponding information on printed wiring board cleaning will be contained in a separate companion document.
Purpose ... -
IPC TM-650 2.3.40
Abstract: This test method establishes a procedure for determining the thermal decomposition temperature of organic films using thermogravimetric analysis (TGA).