Now showing items 1-20 of 369

      • JEDEC EIA-318-B 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;1999
        Organization : JEDEC - Solid State Technology Association
        Abstract: This standard describes the measurement of signal diodes (IF <=500mA dc) reverse recovery times of less than 300 ns duration. It may, however, also be used for the measurement of longer recovery times. This standard is ...
        Subject(s) : Diodes , Measurement , Reverse Recovery Time , Signal Diodes ,
      • JEDEC EIA-323 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;2002
        Organization : JEDEC - Solid State Technology Association
        Abstract: This standard is applicable to life testing of lead-mounted semiconductor devices intended for applications in a natural air-cooled environment where most of the power dissipation is obtained by convection and radiation ...
        Subject(s) : Air Convection Cooled Life Test , Environment of Life Test for Lead-Mounted Devices , Life Testing - Lead Mounted Semiconductor Devices ,
      • JEDEC EIA-365 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;1984
        Organization : JEDEC - Solid State Technology Association
        Abstract: The purpose of this standard is to classify the output of solar cells for space vehicle service in accordance with requirements of EIA Format JS4-RDF4.
        Subject(s) : Calibration Procedure - Solar Cells , Solar Cells , Space Vehicle Service ,
      • JEDEC EIA-397 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;1979
        Organization : JEDEC - Solid State Technology Association
        Abstract: One section of this standard presents a thorough explanation of thyristor principals, defining thedifferent classes of these devices, their Physical structure and detailing the numerous test methods and ratings required ...
        Subject(s) : Test Method - Thyristors , Thyristors ,
      • JEDEC EIA-397-1 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;1980
        Organization : JEDEC - Solid State Technology Association
        Abstract: A compilation of 12 new or revised thyristor test methods which have been adopted since the original standard was issued in 1972.
        Subject(s) : Thyristor Test Methods ,
      • JEDEC J-STD-020D.1 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;2008
        Organization : JEDEC - Solid State Technology Association
        Abstract: This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress. It is used to determine what classification level should be used for ...
        Subject(s) : Moisture Sensitivity , Nonhermetic , Reflow ,
      • JEDEC J-STD-033C 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;2012
        Organization : JEDEC - Solid State Technology Association
        Abstract: This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture sensitive devices made with ...
      • JEDEC J-STD-035 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;2010
        Organization : JEDEC - Solid State Technology Association
        Abstract: This test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting anomalies ...
      • JEDEC J-STD-609A.01 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;2011
        Organization : JEDEC - Solid State Technology Association
        Abstract: This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This standard describes the marking of components and the labeling of their shipping containers to identify ...
        Subject(s) : Labeling , Marking , Pb , PB-Free , PCB ,
      • JEDEC JEB15 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;1969
        Organization : JEDEC - Solid State Technology Association
        Abstract: This bulletin explains the terminology and methods of measurement for bistable semiconductor microcircuits. It is also intended to be used with the EIA Registration Data Format for semiconductor integrated bistable logic ...
        Subject(s) : Letter Symbols , Quick Reference Guide , Symbols - Quick Reference Guide Data Sheet Disclaimers ,
      • JEDEC JEB19 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;1972
        Organization : JEDEC - Solid State Technology Association
        Abstract: This recommendation applies to MOS Shift Registers. Definitions are given for P-channel registers but are applicable to all CMOS and N-channel with changes in power supply notation. 
      • JEDEC JEB5-A 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;1984
        Organization : JEDEC - Solid State Technology Association
        Abstract: The purpose of this bulletin is to recommend for use in the rating of semiconductor logic gating microcircuits which use the binary states to represent and process logic information. Both static and dynamic measurements ...
        Subject(s) : Logic Gating Microcircuits , Measurement - Static and Dynamic ,
      • JEDEC JEDEC/ECA JS709A 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;2012
        Organization : JEDEC - Solid State Technology Association
        Abstract: This standard provides terms and definitions for "low-halogen" passive and solid state devices and recommends methods for marking and labeling. This standard may be applied to all nonmetallic and nonceramic materials of ...
      • JEDEC JEP103A 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;2003
        Organization : JEDEC - Solid State Technology Association
        Abstract: In order to improve understanding between manufacturers and users, a consistent set of product-documentation classifications associated with the stages of product development.
        Subject(s) : Classifications , Data Sheet Disclaimers , Disclaimers , Product-Documentation Classifications ,
      • JEDEC JEP104C.01 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;2003
        Organization : JEDEC - Solid State Technology Association
        Abstract: This publication provides a quick reference to the letter symbols and corresponding terms that are defined in JESD77-B, Terms, Definitions, and Letter Symbols for Discrete Semiconductor and Optoelectronic Devices; JESD99-A, ...
        Subject(s) : Letter Symbols , Memory Integrated Circuits , Microcomputers , Microprocessors , Optoelectronic , Semiconductor , Symbols - Quick Reference Guide ,
      • JEDEC JEP106AB 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;2010
        Organization : JEDEC - Solid State Technology Association
        Abstract: The manufacturer's identification code is defined by one or more eight (8) bit fields, each consisting of seven (7) data bits plus one (1) odd parity bit. The manufacturer's identification code as shown in Table 1, is ...
      • JEDEC JEP110 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;1988
        Organization : JEDEC - Solid State Technology Association
        Abstract: This publication is intended for power GaAs FET applications requiring high reliability. An accurate measurement of thermal resistance is extremely important to provide the user with knowledge of the FETs operating temperature ...
        Subject(s) : GaAs FETs , Measurement - Thermal Resistance of GaAs FETs , Thermal Resistance - GaAs FETs ,
      • JEDEC JEP113-B 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;1999
        Organization : JEDEC - Solid State Technology Association
        Abstract: Certain PSMC (Plastic Surface-mount Components) are subject to permanent damage due to moisture-induced failures encountered during high-temperature surface-mount processing unless appropriate precautions are observed. The ...
        Subject(s) : Labels - Moisture Sensitive , Moisture Sensitive - Symbol and Labels , Symbol - Moisture Sensitive ,
      • JEDEC JEP114.01 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;2007
        Organization : JEDEC - Solid State Technology Association
        Abstract: This publication was developed to help the user of this test methodology avoid common interference Æs to successful application. The guide contains sections on typical specification requirements, sources of ...
        Subject(s) : Certification - PIND Testing , Noise Detection - Particle Impact , Operator Training - PIND Testing , PIND - Particle Impact Noise Detection ,
      • JEDEC JEP115 

        Type: standard
        Source: JEDEC - Solid State Technology Association:;1999
        Organization : JEDEC - Solid State Technology Association
        Abstract: The purpose of this Test Method is to establish electrical criteria for comparing and specifying power MOSFET performance under high dose rate radiation. 
        Subject(s) : Dose Rate - Power MOSFETs , Power MOSFETs - Dose Rate , Test Method - Dose Rate , Transistors ,