Browsing IPC - Association Connecting Electronics Industries by Issue Date
Now showing items 1-20 of 793
-
IPC TM-650 2.4.20
Abstract: This test method is to determine the terminal bond strength, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane. -
IPC TM-650 2.3.1
Abstract: This test method covers acceptance of incoming copper clad epoxy-glass laminates ranging in thickness from 0.8 mm to 6.5 mm, clad on one or both sides. It provides for a standard method of inspection and establishes ... -
IPC TM-650 2.5.4
Abstract: This test method is to determine allowable current load for conductors. -
-
IPC TM-650 2.4.14
Abstract: The purpose of this test is to determine the solderability of printed circuit boards (PCBs) that are to be joined by a soldering operation employing rosin flux and immersion in molten solder or by use of a soldering iron. -
-
IPC TM-650 2.4.5
Abstract: This method is used to determine the mechanical and electrical behavior of flexible printed wiring materials after exposure to two cycles of folding. -
IPC TM-650 2.4.11
Abstract: This method covers the punch-type shear test to determine the shear strength of flexible dielectric substrate materials. -
IPC TM-650 2.3.11
Abstract: The purpose of this test method is to provide a procedure for examining glass fabric to determine its construction, including its weight, thickness, strength, and type of weave. Since this method may be used to examine ... -
IPC TM-650 2.3.14
Abstract: This test method provides a standard method for evaluating the effect of established processing operations used in the manufacture of PWBs on materials that are considered for use in the manufacture of PWBs. Specific ... -
IPC TM-650 2.4.6
Abstract: The determination of lamination bond quality by immersion in an oil stabilizing high temperature bath. -
IPC TM-650 2.4.17
Abstract: This method is to determine the average force in grams required to propagate tearing through a specific length of the constant radius specimen. Because of the variation of materials and orientation of fibers, the method ... -
IPC TM-650 2.5.2A
Abstract: The purpose of this test is to measure the capacitance effects arising from plastic substrates, adhesives, or coatings, which may be critical to the reliable functioning of a circuit. -
IPC TM-650 2.3.6A
Abstract: To determine the quality of the dielectric material after etching with ammonium persulfate. -
IPC TM-650 2.5.8A
Abstract: This test method provides a standard procedure to determine the dissipation factor of printed circuit materials. -
IPC TM-650 2.5.5A
Abstract: The purpose of this test method is to provide a procedure to determine the dielectric constant at 1 MHz of laminate or substrate material. -
IPC TM-650 2.4.7A
Abstract: This method is designated for use in determining the ease of machining of plastic materials and the effect of such machining on the cutting tools and plastic. -
IPC TM-650 2.3.7A
Abstract: To determine the quality of the dielectric material after etching with ferric chloride. -
IPC TM-650 2.2.12A
Abstract: This method of test covers the procedure for determining weight (average thickness - by weight measurement) of copper foil for printed circuits.